An anonymous reader writes "Sony has demonstrated a thermal sheet that it claims matches thermal paste in terms of cooling ability while beating it on life span. The key to the sheet is a combination of silicon and carbon fibers, to produce a thermal conductive layer that’s between 0.3 and 2mm thick.
In the demonstration, the same CPU was cooled by thermal paste and the thermal sheet side-by-side, with the paste keeping the processor at a steady 53 degrees Celsius. The sheet achieved a slightly better 50 degrees Celsius. The actual CPU used in the demonstration wasn’t identified.
Sony wants to get the thermal sheet used in servers and for projection units, but I can definitely see this being an option for typical PC builds, too. It's certainly going to be less messy and probably a lot cheaper than buying a tube of thermal paste."
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