Beta

Slashdot: News for Nerds

×

Welcome to the Slashdot Beta site -- learn more here. Use the link in the footer or click here to return to the Classic version of Slashdot.

Thank you!

Before you choose to head back to the Classic look of the site, we'd appreciate it if you share your thoughts on the Beta; your feedback is what drives our ongoing development.

Beta is different and we value you taking the time to try it out. Please take a look at the changes we've made in Beta and  learn more about it. Thanks for reading, and for making the site better!

Mass 450mm wafers production by 2018

Taco Cowboy (5327) writes | about 2 years ago

Hardware 0

Taco Cowboy (5327) writes "Taiwan Semiconductor Manufacturing Co (TSMC) the world’s top contract chipmaker, yesterday said it planned to start mass-producing next-generation 450mm wafers using advanced 10-nanometer technology in 2018.

The advanced 10-nanometer chips could first be used in mobile devices and other consumer electronics, like game consoles, that demand high-performance and low power consumption.

The plan was included in the latest technology roadmap unveiled by TSMC about one year after the chipmaker attributed its delay in making 450mm wafers, originally scheduled in 2015, to semiconductor equipment suppliers’ postponement in developing advanced equipment for manufacturing amid the industrial slump.

Chipmakers can get 2.5 times more chips from a 450mm wafer than from a 300mm wafer.

Taiwan and South Korea are expected to be the two largest markets for semiconductor equipment this year, with purchases totaling US$9.26 billion and US$11.48 billion respectively, according to SEMI figures.

While in other news, Industry migration to 3D ICs to take place in 2015-16
http://www.digitimes.com/news/a20120904PD209.html

The industry's gradual migration toward 3D ICs with through-silicon vias (TSV) is unlikely to happen until 2015 or 2016, according to sources at semiconductor companies. Volume production of 3D ICs was previously estimated to take place in 2014.

Leading foundries and backend assembly and test service companies have all devoted much of their R&D efforts to TSV development, and are making progress. The major players are believed to be capable of supporting 3D ICs by 2014, but the emerging technology going into commercial production may not take place until around the 2015-16 timeframe."

Link to Original Source

cancel ×

0 comments

Check for New Comments
Slashdot Account

Need an Account?

Forgot your password?

Don't worry, we never post anything without your permission.

Submission Text Formatting Tips

We support a small subset of HTML, namely these tags:

  • b
  • i
  • p
  • br
  • a
  • ol
  • ul
  • li
  • dl
  • dt
  • dd
  • em
  • strong
  • tt
  • blockquote
  • div
  • quote
  • ecode

"ecode" can be used for code snippets, for example:

<ecode>    while(1) { do_something(); } </ecode>
Create a Slashdot Account

Loading...